MILPITAS, CA – Global semiconductor manufacturing equipment sales will reach $125.5 billion this year, up 7.4% year-over-year, according to SEMI’s mid-year report. Growth is being fueled by AI demand ...

PEACHTREE CITY, GA – JULY 22, 2025 – The exhibition floor space is almost sold out for this year’s PCB West, the largest exhibition and conference for printed circuit board design, fabrication and ...

Abstracts of 100-500 words and speaker biographies should be submitted to PCEA. Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodologies ...

A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.

GBM finalizes Lincstech acquisition to boost AI server PCB capabilities, expanding operations in Singapore and Malaysia to support growth in advanced tech sectors.

AllSpice.io raises $15 million in Series A funding to scale enterprise features and launch its AI Agent, advancing automation and collaboration for electrical engineering teams.

NEEDHAM, MA – The global server market is on track to reach $366 billion in value this year, marking a 44.6% increase over last year, according to the latest data from IDC’s Worldwide Quarterly Server ...

Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member. “Lincstech has been supporting the electronics industry with ...