Abstract: This paper presents design and implementation of a compact dual-band RF system-in-package (SiP) module for radar applications. Four S-band transceivers and one P-band transceiver are ...
Abstract: The global smartphone shipments has reached more than 1.4 billion units each year and is one of the main driving engine behind semiconductor industry. The transition from 3G/4G to 5G is ...
Within the framework of the BEYOND5 project, CEA-Leti researchers have developed energy-efficient RF power modules based on SOI technology. This innovation won an award at the IEEE RFIC 2025 ...
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