Multi-protocol wireless is emerging as a critical foundation for IoT, as integrated chips balance power, performance and ...

Leaks suggest Apple’s foldable iPhone could feature a four-camera system, split across its inner, outer, and rear surfaces. The outer cover display is expected to house a hole-punch front camera, ...

Although still months away, the next iPhone model is already starting to take shape based on informed speculation online.

Although Apple’s iPhone 18 Pro lineup is still many months away from launch, industry leaks are already coalescing around a ...

At the heart of both devices lies the A19 Pro chip, a processor designed for exceptional speed and energy efficiency.

India’s semiconductor ambitions took a decisive step forward today as Union Minister for Electronics and IT Ashwini Vaishnaw ...

Cisco unveils AI-powered collaboration devices that turn meeting rooms, desks, and frontline tools into managed edge ...

A lot of fans are banking on the company's next-generation Nova Lake parts to be its true return to form, though, and the first generation to provide a credible challenge to AMD's X3D-powered ...

India's semiconductor sector advances, attracting global firms for advanced chip design, says Minister Ashwini Vaishnaw in Bengaluru.

Several Android smartphones made in China are more powerful than the iPhone 17. If you want to avoid Apple's products, one of these devices might suit you.

It looks like a cute little dolphin-themed toy, but don't be fooled—the Flipper Zero is a surprisingly powerful learning tool ...

The Heat Pass Block first appeared in Samsung's 2nm Exynos 2600, reportedly delivering a 16 percent improvement in thermal resistance. It's a copper-based layer built directly ...