Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...

Multi-chip module (MCM) graphics cards just might be the future, bringing upcoming generations of GPUs to a whole new level. Combining multiple dies instead of relying on a single chip could provide ...

Multi-protocol wireless is emerging as a critical foundation for IoT, as integrated chips balance power, performance and ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Historically, GPUs have been designed as monolithic dies with all of their functionality under one 'roof.' This hasn't always been the case -- the earliest GPUs sometimes used separate chips for ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

Mouser Electronics is now stocking the PIC32WM-BZ6 multiprotocol module from Microchip Technology. The PIC32WM-BZ6 is a highly integrated ...

ANDOVER, Mass., March 18, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (MRCY) (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today ...

[Willem Melching] owns a 2010 Volkswagen Golf – a very common vehicle in Europe – and noticed that whilst the electronic steering rack supports the usual Lane Keep Assist (LKAS) system, and would be ...

“More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems.