Test and burn-in of integrated circuits can be performed by a new socket that accommodates packages from 41 mm2 to 55 mm2. This covers ICs such as SRAMs, DRAMs, DSPs and flash memories. Packages that ...
DesignCon, the US' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center ...
Suited for high-temperature burn-in PC board testing, design stage component testing/evaluation, and burn-in ovens, Sullins transistor sockets, axial sockets, MOSFET sockets, and other custom test ...
When you’re building a quick prototype or a one-off project it’s nice to be able to securely mount the various modules and development boards. Sometimes these boards have mounting holes, but often ...
Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...
that they have reached an agreement in which Antares will assume sales, distribution and service responsibilities for Gryphics' LQFN test-socket line. The strategic relationship is designed to expand ...
For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.
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