The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything.

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

Engineering considerations in multi-chiplet designs.

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at ...

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Leveraging patterns in formal verification to reach sign-off faster.