In a previous article we reviewed rapid forming of thermoplastic composites (TPC). In the second part of this three-part series, we’ll explore the thermal processes and how these can be managed, ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...