Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) -- Power Module Packaging Market Size & Growth Insights: According to the SNS Insider,“The Power Module Packaging Market size was valued at USD 2.53 Billion in ...

New 3300V and 2300V SiC products based on latest GeneSiC™ Trench-Assisted Planar technology and packaging innovations to ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Members can download this article in PDF format. Engineers have many options when designing power stages, from low-dropout (LDO) regulators to switching power supplies. The former provide low noise ...

Tessera Inc. said Monday (April 14) it will introduce chip-scale packaging technology the company claims provides performance, size, and cost advantages for designers of RF modules used in wireless ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/xltmg4/power_module) has announced the addition of the "Power Module ...

Navitas Semiconductor has unveiled a new family of ultra-high voltage SiC devices aimed at mission-critical energy ...

Powerbox has announced the launch of two new products in its railway dc-dc power converters ENAR150D series. The products perform at 93% high efficiency, saving energy and reducing power dissipation.

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...