The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

The foundation of parametric test within semiconductor manufacturing is its usefulness in determining that wafers have been fabricated properly. Foundries use parametric test results to help verify ...

During the manufacture of semiconductor wafers, thickness measurement forms an important part of this process, since it provides process engineers with the information required to ensure that ...

Wafers produced for products as diverse as LEDs and MP3 players vary greatly in function, but they have one thing in common: They often undergo optical inspection after they pass an electrical test.

Multiple-CCD microscope and software lets users set up wafer probes more quickly and accurately Designed for engineers involved with device characterization/modeling or process development, the eVue ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...

The huge number of ICs used in today’s electronic products is difficult to comprehend, and each one has to be tested. Traditionally, testing starts at the wafer level to determine gross defects. By ...