Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

As semiconductor chip technology advances towards nanometre and sub-nanometre scales, the demands becomes exponentially more ...

Failure analysis typically begins with identifying a region of interest (ROI) on a sample for detailed examination using tools such as a Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), or ...

Identifying issues that actually affect yield is becoming more critical and more difficult at advanced nodes, but there is progress. Although they are closely related, yield management and process ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...