System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Microchip’s SAM9X75 hybrid MCU System-in-Package (SiP) enables MPU processing power with the familiar development environment ...
Microchip SAM9X75 hybrid automotive ARM9 MCU is a system-in-package with an ARM926EJ-S core and on-chip DDR2/DDR3L for HMI ...
TL;DR: Broadcom has introduced its 3.5D eXtreme Dimension System in Package (XDSiP) technology, enabling AI customers to develop advanced custom accelerators. This platform integrates over 6000 mm² of ...
A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, ...
Weltrend announced its first GaN-based system-in-package integrating an AC/DC controller and Transphorm’s 240-mΩ, 650-V SuperGaN FET. The WT7162RHUG24A is intended for USB Type- C Power Delivery (PD) ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, ...
The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...
Co-developed by Sequans and Skyworks, the SKY66431 tiny system-in-package enables LTE-M and NB-IoT connectivity for 5G massive IoT deployments. Housed in an 8.8×11.3×1.585-mm BGA package, the SKY66431 ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results