ANDOVER, Mass., Jan. 22, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today introduced ...

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 ...

TEL AVIV, Israel--(BUSINESS WIRE)--Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, will showcase live demos of its latest SoMs at Embedded World 2025, held ...

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...

When tariffs began reshaping the electronics landscape post-Liberation Day, I watched technology companies, large and small, grapple with a critical question: How much of their product architecture ...

Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...