The integration of optical components on a chip creates a host of new challenges and demands for wafer-level probing of SiPh devices. As chip designers are pressed for ever-increasing data rates, the ...
Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest advancements in transfer printing (TP) technology. The team detailed its practical ...
Implementing energy-efficient optical transceiver modules with silicon photonics (SiPh) and 3DIC technologies will help alleviate the increasing energy consumption for hyperscale data centers. To ...
Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy integrating wafer ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback