Decision making is a critical step in semiconductor technology development. R&D semiconductor engineers must consider different design and process options early in the development of a next-generation ...

When merging optical functions, one may need to provide for the continuous propagation of light across a portion of the chip from one structure to another. To minimize or eliminate any trade-offs in ...

The optimisation of process planning has emerged as a pivotal aspect of modern manufacturing, where genetic algorithms (GAs) and hybrid techniques are leveraged to address the combinatorial complexity ...

The concept of hybrid AI in PM, highlighting the connections between the various components of hybrid AI tools for PSE (left), the four selected PM topics (middle), and examples of problems (right) ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

Process capability indices (PCIs) have long served as crucial metrics in assessing the performance and quality of manufacturing processes. Recent advances in statistical estimation techniques have not ...

In this chapter, we report our broad conclusions related to each of the themes we introduced at the start of the report. These conclusions reflect detailed consideration of (1) our research into ...

As a follow-up to my previous blog, Integration Choices: Analog Filters vs. Digital Filters, the next step would be to discuss how to integrate filters into the IC itself. What techniques and ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...