Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

With process nodes and die sizes shrinking, the number of consumer products incorporating ICs with flip-chip packaging is growing. Unfortunately, flip-chip package manufacturing rules have not kept ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the certification of the Cadence ® tools in TSMC reference flows for TSMC’s latest InFO and CoWoS ® ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

The vise is closing down on design departments.Manufacturers want more capabilitiesin their products than ever before. It’simperative for manufacturers to remaincompetitive. Marketing, meanwhile,wants ...