OSLO, Norway, Oct. 31, 2017 (GLOBE NEWSWIRE) -- NEXT Biometrics Group ASA (Oslo Bors:NEXT) today announced it has begun mass production shipments of its NB-2034-S2 sensor module, designed to meet the ...
Samsung unveiled the LPCAMM form factor memory module, designed for next-generation notebook PCs, with a significant reduction in size compared to SO-DIMM. This announcement was made on September 26, ...
GlideSense™ with Boréas’ Piezo Haptic Trackpad technology, the first trackpad module that helps PC manufacturers meet rising demand for richer, more responsive tactile experiences in trackpads that ...
SUWON, South Korea, Dec. 19, 2024 /PRNewswire/ -- Zinitix, a leader in human-to-machine interface through technical innovation in touch controller IC and module, autofocus/optical image stabilization, ...
SAN JOSE, Calif. — In a presentation at the PCI Special Interest Group developer's conference here next week, engineers will discuss a wireless module that can use either a 1X Express or a USB 2.0 ...
Dell has pulled back the covers on three new work designed notebooks coming from their Precision and Latitude families. The new notebooks feature the use of new technologies like a "collaboration ...
Taiwan-based notebook cooling module maker Chaun-Choung Technology (CCI) saw its consolidated revenues in May 2010 increase 2.3% sequentially, while Auras Technology and Forcecon Technology saw their ...
JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...
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