Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd. TEL announced that its LGA (land grid array) 3647 Socket would be used in Intel Corporation’s INTC new processors per ...

Accommodating 0.65-mm pitch LGA devices, the XG-LGA-7000 socket supports a 12-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. The component dissipates up ...

Ironwood Electronics recently introduced a new LGA socket—Model CBT-LGA-5019—addressing high-performance requirements for 1-mm-pitch optical engines. The contactor is a stamped spring pin with 19-g ...

Intel's upcoming Alder Lake CPUs are still a few weeks away from launching, presumably, but there is plenty of related hardware in the wild to keep the leaks flowing. The latest one is an actual photo ...

Much has been made of next-generation platforms on the horizon from AMD and Intel. Both are planning to embrace DDR5 memory, the former with its Zen 4 platform and the latter with Alder Lake-S. Along ...

When Intel introduced the LGA 1700 platform with their Alder Lake-S processors late last year, one of their key comments on the new socket design was that they fully intended to retain it for at least ...

Late last week, information appeared online suggesting that (surprise surprise) Intel was likely going to welch on its promise to retain LGA 1700 for three processor generations and that their ...

Intel's LGA 1851 socket is waiting in the wings to replace LGA 1700, used on both Alder and Raptor Lake platforms. It'll get a new lease on life soon with the upcoming Raptor Lake refresh, but its ...

TE Connectivity (TE), a world leader in connectivity and sensors, today announced its LGA 3647 Socket for Intel Corporation’s new processors specified under their new server platforms. TE’s LGA 3647 ...

From the looks of it Comet Lake-S and Rocket-Lake-S will be the only two generations processors that will work on the LGA1200 series motherboards, at least that's how it seems right now. That means ...