Black Semiconductor GmbH, a startup that plans to make chip-to-chip interconnects from graphene, has secured €254.4 million in funding to support its research. The investment was disclosed today.

Chipmakers’ focus on new interconnect technology is ramping up as copper’s effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat ...

To help designers experiment with these architectures, NanoIC has released the first versions of its fine‑pitch RDL and D2W ...

Smiths Interconnect, a leading provider of high-reliability connectivity products and solutions serving segments of aerospace and defense, medical, semiconductor test, and industrial markets, ...

Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. Samsung Catalyst Fund and Tiger Global Management both led the round to ...