Agilex 7 FPGA M-Series Optimized to Reduce Memory Bottlenecks in AI and Data-intensive Applications SAN JOSE, Calif.--(BUSINESS WIRE)-- Altera Corporation, a leader in FPGA innovations, today ...
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SK hynix orders new equipment, possibly for production of next-gen HBM4
SK hynix Inc. has ordered new high bandwidth memory (HBM) production equipment from Hanmi Semiconductor Co., a regulatory ...
SK Hynix, Samsung, TSMC, and Micron are investing billions to meet demand for high-bandwidth memory and advanced chips for ...
On December 2, 2024, the Department of Commerce, Bureau of Industry and Security (BIS) issued a new set of regulations targeting semiconductors manufacturing equipment (SME) and high-bandwidth memory ...
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NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...
High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory ...
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources ...
SanDisk just held its first Investor Day since being spun off from Western Digital, and while most of the event was the usual financial talk, the company also gave a glimpse into its R&D priorities.
The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...
Samsung Electronics has reportedly passed Nvidia's quality testing for 12-layer fifth-generation high bandwidth memory (HBM3E) and is set to begin shipments, according to multiple South Korean media ...
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