As the heat density increases at the die level of more powerful semiconductor devices, there becomes a greater need for new and innovative cooling solutions. Standard Aluminum extrusions and bonded ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

In recent years, the use of Phase Change Materials (PCMs) in thermal management systems (TMS) has garnered increased interest due to their high latent heat storage capacity, which enables effective ...