IEEE Spectrum on MSN

The ultimate 3D integration would cook future GPUs

D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...
Digi Times

SK Hynix races ahead in HBM with next-gen innovation

SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions. This strategic ...
KHON2

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. The study allows to identify and mitigate thermal ...
TweakTown

SK hynix preparing full stack of AI memory provider vision at CES 2025, leads with HBM3E, HBM4

TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...

A GPU or a CPU with 4TB HBM-class memory? Nope, you're not dreaming, Sandisk is working on such a monstrous product

SanDisk unveils High Bandwidth Flash (HBF), a NAND-based alternative to HBM HBF matches HBM bandwidth, offering 8–16x ...
KVOA 4

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures Imec ...