Researchers from Taiwan’s National Nano Device Laboratories are looking to etch away defects that form when nanometre germanium transistors are built on silicon substrates. “At 14nm and smaller sizes, ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
The semiconductor industry thrives on precision and innovation, as every nanometer can make the difference between groundbreaking performance and obsolescence. In this hyper-competitive landscape, ...
Each of the inspection systems in the new portfolio features seamless connectivity to the recently introduced eDR-7000 e-beam wafer defect review system. With outstanding sensitivity and review speed, ...
Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting ...
These strategies are described in more detail in the following sections. Skeleton Etch or Anisotropic Removal of Dielectric Layers This method involves anisotropic removal of all dielectric layers ...
Schematic diagram of the method for directly visualizing defects in 2D semiconductors. (Courtesy: G Zhang) Directly visualizing structural defects in semiconductors on large scales is no easy task.
The Applied Materials Centris® Sym3® Y etch system enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips. The Applied Materials Centris® Sym3® ...
Sym3® Y tailored to critical conductor etch applications in 3D NAND, DRAM and foundry-logic nodes Newest offering broadens adoption of the fastest-ramping product in company history Milestone reached: ...
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