“The demand for accurate information about the internal structure and characteristics of dynamic random-access memory (DRAM) has been on the rise. Recent studies have explored the structure and ...
BANGALORE, India, Jan. 8, 2026 /PRNewswire/ -- The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, ...
What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...
Hosted on MSN
3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module
NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
Cryptopolitan on MSN
Micron agrees $1.8 billion deal for Powerchip’s P5 Taiwan fab to increase DRAM output
Micron signed a $1.8 billion letter of intent to buy Powerchip Semiconductor Manufacturing Corp’s P5 fabrication site in ...
The rapid evolution of persistent memory (PM) technologies has spurred a significant shift in how data structures and algorithms are designed and implemented. Persistent memory, offering ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback