Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...

With solar grade polysilicon prices having plummeted in recent years, cutting down on consumption of the material has not been a priority. But strategies exist and significant savings can be made ...