With Design-For-Test (DFT), test coverage is the typical yardstick used to gauge the quality of the manufacturing tests being performed. But as next-generation designs become more complex, traditional ...

Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...

Memory test at-speed isn't easy but can be achieved by balancing test selection, area overhead, and test-time constraints. The semiconductor industry has intensified its focus on yield issues to meet ...

In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, ...

New manufacturing test challenges are raised with SoC technology advances where both test quality and test costs are affected with a direct impact on current Design-For-Test (DFT) methodologies and ...

Until very recently, semiconductor design, verification, and test were separate domains. Those domains have since begun to merge, driven by rising demand for reliability, shorter market windows, and ...

Join us on Wednesday, December 15 at noon Pacific for the Design for Test Hack Chat with Duncan Lowder! If your project is at the breadboard phase, or even if you’ve moved to a PCB prototype, it’s ...

Electronics design and testing were once two distinct functions where an electronic design was breadboarded and populated before testing. Problems that emerged during testing may have forced some time ...

Siemens has acquired Aster Technologies, a privately held company in the printed circuit board market. Aster produces test verification and engineering software. This strategic move integrates Aster’s ...