Add a highly integrated RF and baseband chipset and ready-to-go-wireless module to the rapidly expanding list of components vying for use in the many Bluetooth products under development by OEMs ...
Camarillo, Calif. — A chipset for 10-Gbit 300-pin modules has been developed that combines a transceiver, transimpedance amplifier (TIA), and electro-absorption modulator (EAM) driver. The VSC8473 ...
Norwood, M.A. —Analog Devices, Inc. announced its new XFP (10 Gbit small form-factor pluggable) optical transceiver chipset and reference design. XFP is rapidly becoming the leading standard for ...
SHENZHEN, China--(BUSINESS WIRE)--Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA ...
EQS Group-Media / 11.06.2019 / 09:00 Press Release u-blox redefines IoT security with 5G-ready cellular module and chipset for low power wide area IoT applications The module offers unprecedented ...
The circuitry needed to control multi-line character display modules has been integrated into a chipset consisting of an 18-bit A/D converter and a pre-programmed microprocessor. Designed to minimize ...
Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset Powering next-gen LPWA solutions with an ultra-low power 5G cellular+ module for IoT February 21, 2023 ...
SAN JOSE, Calif.--(BUSINESS WIRE)---- (NASDAQ: ), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new family of state-of-the-art DDR5 ...
Introduces industry-leading LPDDR5 CAMM2 PMIC and DDR5 Gen 2 Client PMIC alongside Client Clock Driver and SPD Hub for high-performance notebooks, desktops and workstations Supports wide range of ...
SHANGHAI, Nov. 6, 2018 /CNW/ -- Quectel Wireless Solutions (Quectel), the leading global supplier of IoT modules today announced the global launch of the automotive grade C-V2X module AG15, which ...
Team Group announces that all memory module series, including Xtreem and Elite, now provide complete support for the latest Series 7 chipsets of Intel. Meticulous verification tests have proven that ...
Fibocom to be first in providing engineering samples of 5G module based on MediaTek chipset platform
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is ...
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