In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is ...
A breakthrough ultra-high-efficiency semiconductor cooling technology capable of drastically reducing the power consumption of AI data centers has bee ...
The channels in Microsoft’s new microfluidics design match the heat signatures of chips, resembling the veins of a plant. (Microsoft Photo) REDMOND, Wash. — About 5 minutes before each hour, and 5 ...
Samsung’s upcoming Exynos 2700 processor is getting a complete structural redesign focused heavily on thermal management. According to supply chain rumors, the new layout will physically separate the ...
Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are ...
In a nutshell: For more than half a century, the relentless progress of Moore's Law has driven engineers to double the number of transistors on a chip approximately every two years, fueling ...
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